IICIE国际集成电路创新博览会
It covers the complete IC value chain — chip & IC design, power semiconductors, wafer fabrication, packaging & testing services, semiconductor equipment, key materials and core components. The first IICIE edition closed on 11 September 2026 with strong growth, and the 2027 edition returns to Shenzhen World (Bao'an) on 8–10 September 2027.
Shenzhen · Electronics · Next: IICIE - International Integrated Circuit Innovation Expo 2027 (Dates TBC)
GigaDevice expanded its optical communication portfolio with the GD32E512 and GD32E252 series MCUs designed for optical modules, extending its GD32 MCU line into high-speed optical interconnect control alongside its Wi-Fi 6/BLE 5.2 wireless modules and humanoid-robot full-stack IC solutions.
SourceNaura released its first 12-inch advanced gas-cluster ion-beam etch tool, the Acme Glaion130, and its third-generation 12-inch all-quartz vertical silicon-nitride LPCVD equipment, targeting domestic high-end thin-film and etching process requirements.
SourceIICIE 2026 co-located with CIOE and elexcon to gather over 5,000 exhibitors across 340,000 m2 and project more than 240,000 professional visitors, integrating chips, components, modules, solutions and applications under one platform with dedicated AI, RISC-V and advanced packaging zones.
SourceLaunches at IICIE span the IC chain: GigaDevice's optical-module MCUs, ams OSRAM's thin-film VCSEL for AI scale-up, Coherent's 1.6T-DR8 silicon-photonics transceiver, Rockchip's RISC-V RK182X local-LLM coprocessor, and Naura's Acme Glaion130 12-inch gas-cluster ion-beam etcher.
SourceIICIE 2027 returns to Shenzhen World (Bao'an) on 8–10 September 2027, covering wafer fabrication, packaging & testing, semiconductor equipment, key materials and core components. Running alongside CIOE and elexcon, the three shows total about 320,000 m2 with over 5,000 exhibitors and more than 320,000 expected professional visitors.
SourceThe first IICIE edition (9–11 September 2026) closed with 50,000 m2 of exhibition space, 935 exhibiting companies and 86,452 professional visitors, up 97% year on year, including 2,585 overseas visitors and 243 organised visiting groups, backed by 24 concurrent conferences and 300 speakers.
Sourceams OSRAM unveiled a breakthrough Thin-Film VCSEL for AI scale-up, showcasing a connectorized multi-core fiber solution, while its TMF8829 SPAD-based direct time-of-flight sensor offers configurable resolution and up to 11 m detection range with on-chip processing for sensing applications.
SourceCoherent launched PhotonLink, an integrated optics platform spanning the complete optical signal chain for next-generation AI datacenters, and demonstrated a silicon-photonics 1.6T-DR8 transceiver using a Marvell 3nm optical DSP with 200 Gbps electrical and optical interfaces.
SourceRockchip presents its RK182X series RISC-V AI coprocessor with integrated DRAM and NPU for local 3B/7B large-model and multimodal inference, alongside the RK3576 octa-core processor with 6 TOPS NPU and rich high-speed interfaces for AIoT deployment.
SourceMontage Technology supplies interconnect chips for cloud and data-center infrastructure, covering DDR memory interface and companion chips, PCIe Retimer signal-conditioning devices, CXL memory expansion controllers and clock chips for high-speed server links.
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