Dates TBC · ·
SourceIICIE 2027 returns to Shenzhen World (Bao'an) on 8–10 September 2027, covering wafer fabrication, packaging & testing, semiconductor equipment, key materials and core components. Running alongside CIOE and elexcon, the three shows total about 320,000 m2 with over 5,000 exhibitors and more than 320,000 expected professional visitors.
Sourceams OSRAM unveiled a breakthrough Thin-Film VCSEL for AI scale-up, showcasing a connectorized multi-core fiber solution, while its TMF8829 SPAD-based direct time-of-flight sensor offers configurable resolution and up to 11 m detection range with on-chip processing for sensing applications.
SourceCoherent launched PhotonLink, an integrated optics platform spanning the complete optical signal chain for next-generation AI datacenters, and demonstrated a silicon-photonics 1.6T-DR8 transceiver using a Marvell 3nm optical DSP with 200 Gbps electrical and optical interfaces.
SourceRockchip presents its RK182X series RISC-V AI coprocessor with integrated DRAM and NPU for local 3B/7B large-model and multimodal inference, alongside the RK3576 octa-core processor with 6 TOPS NPU and rich high-speed interfaces for AIoT deployment.
SourceMontage Technology supplies interconnect chips for cloud and data-center infrastructure, covering DDR memory interface and companion chips, PCIe Retimer signal-conditioning devices, CXL memory expansion controllers and clock chips for high-speed server links.
Source