Dates TBC · ·
SourceGigaDevice expanded its optical communication portfolio with the GD32E512 and GD32E252 series MCUs designed for optical modules, extending its GD32 MCU line into high-speed optical interconnect control alongside its Wi-Fi 6/BLE 5.2 wireless modules and humanoid-robot full-stack IC solutions.
SourceNaura released its first 12-inch advanced gas-cluster ion-beam etch tool, the Acme Glaion130, and its third-generation 12-inch all-quartz vertical silicon-nitride LPCVD equipment, targeting domestic high-end thin-film and etching process requirements.
SourceIICIE 2026 co-located with CIOE and elexcon to gather over 5,000 exhibitors across 340,000 m2 and project more than 240,000 professional visitors, integrating chips, components, modules, solutions and applications under one platform with dedicated AI, RISC-V and advanced packaging zones.
SourceLaunches at IICIE span the IC chain: GigaDevice's optical-module MCUs, ams OSRAM's thin-film VCSEL for AI scale-up, Coherent's 1.6T-DR8 silicon-photonics transceiver, Rockchip's RISC-V RK182X local-LLM coprocessor, and Naura's Acme Glaion130 12-inch gas-cluster ion-beam etcher.
SourceThe first IICIE edition (9–11 September 2026) closed with 50,000 m2 of exhibition space, 935 exhibiting companies and 86,452 professional visitors, up 97% year on year, including 2,585 overseas visitors and 243 organised visiting groups, backed by 24 concurrent conferences and 300 speakers.
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